About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
Our focus is on the following market segments:
- Smartcards and discrete packages
- MEMS and sensor packages
- Leadless and substrate-based packages
- Special application packages
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.