About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

Our focus is on the following market segments:

• Smartcards and discrete packages
• MEMS and sensor packages
• Leadless and substrate-based packages
• Special application packages

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.