About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

Our focus is on the following market segments:

  • Smartcards and discrete packages
  • MEMS and sensor packages
  • Leadless and substrate-based packages
  • Special application packages

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.

For more information please contact This e-mail address is being protected from spambots. You need JavaScript enabled to view it.


Additional information