Boschman Technologies

  • Skip to content
  • Jump to main navigation and login

Nav view search

Navigation

Search

You are here: Home Applications QFN
  • Home
  • Company profile
  • Molding systems
  • Applications
    • BGA
    • Discretes
    • HB-Leds
    • MEMS and Sensors
    • Power packages
    • Pre-molded lead frames and packages
    • QFN
    • Smartcards
    • Specials and non-semiconductor
    • Use of very sticky compounds
    • Wafer Level Encapsulation
  • Molding principles
  • Regional contacts
  • Meet us at exhibitions
  • Careers
  • Related web sites
  • Search
  • Request information
  • Print

QFN

We offer all QFN package types. Standard over molded QFN (pre-tape and AFT), Map-type, Punch-type, multi-die-pad QFN, Exposed die QFN, Power QFN, Flip-chip QFN, etc.

© 2012 Boschman Technologies | All rights reserved