Use of very sticky compounds

Good compound adhesion to the device and lead frame or substrate is crucial. In order to improve adhesion between the different materials, adhesion promotors are used in the compound. This results in the compound adhering to the mold extremely well. However, when opening the mold, ejectors and cavity wall exercise great force on the package, often leading to compound fouling on mold surfaces. As a result, molds have to be cleaned more regularly, which drastically reduces uph. Sticky compound also leads to significantly higher tooling costs as it speeds up mold wear and increases maintenance needs. Double-sided Film-Assisted Molding now wipes out these negative factors. Its benefits are impressive: excellent molding quality (no sticking, no non-fills, no delamination), higher yield, highest possible uph (zero mold cleaning time), zero mold wear, zero tooling costs, zero cleaning costs. Film costs are additional costs that need to be offset against the gains in quality and lower operational costs.