Regional Sales Manager Central Europe & Scandinavia


Are you looking for an exciting career as a Regional Sales Manager in the semiconductor industry? Would you like to work for the specialist of high-end packaging equipment? At APC and Boschman Technologies we developed several unique patented technologies. We are looking for a - highly motivated - colleague to continue our growth.


Your role as a Regional Sales Manager

As our new Regional Sales Manager you will be responsible for selected accounts within Central Europe and Scandinavia. With your network in and experience with the semiconductor packaging world your focus is on MEMs, sensors, optical-, medical- and power devices. You will be part of our experienced salesteam and work closely with the owners of the company. You will be working from our headquarters in Duiven (near Arnhem).


What do we expect from our Regional Sales Manager?

• Candidate should have demonstrable experience in sales, business development and account management
• Candidate should have demonstrable knowledge of the semiconductor back-end industry
• Candidate should have a sizeable network within Europe with leading and innovative semiconductor companies, preferably in MEMs, sensors, optical technology or power devices
• Good English language skills are necessary, Dutch and German are preferred
• Bachelor or Masters degree in a relevant field (eg Electronics, Mechanics)


What do we offer?

First of all a market conform salary. A challenging job with potential to growth. This in a high-tech industry and in a “no nonsense” company culture with a promising future. At APC and Boschman Technologies we have short communication lines and fast decision making.


About Advanced Packaging Center & Boschman Technologies

The Boschman Group, through its subsidiaries Boschman Technologies and Advanced Packaging Center, provides full solutions for the development and production of semiconductor packaging solutions specifically in transfer-molding and silver sintering die-attach. They focus on sensors, medical, optical and power devices.



Advanced Packaging Center (APC) is a one-stop-shop supplier for full packaging development solutions (die-attach or sintering/wire-bond/moulding), as well as low-mid volume production, of semiconductor, sensor and medical/optical devices. They focus on large, complex and advanced packages or low-mid volume packages with large flexibility or added-value. APC provides: Consultancy, Package development and/or tool design/development, Sample workshop service (functional samples), Package production service and support and In-house production (low-mid size volumes).


Boschman Technologies

Boschman Technologies is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Technologies is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Systems are produced for the full 100 % at Boschman Technologies Asia in Singapore. Opened in 1997.


For more detailed information please visit our websites and

Would you like to meet us? You are welcome!

For more information about the position of Regional Sales Manager Central Europe & Scandinavia please contact our recruiter Mr. Sander Liebrand. Mobile +31 (0)6 4620 5615. You can send your resume and motivation letter to This e-mail address is being protected from spambots. You need JavaScript enabled to view it. .