Film-Assisted Molding (FAM) technologies.
Film-Assisted Molding is a cluster of proprietary technologies of Boschman Technologies comprising a variation on the transfer molding process. The Film-Assisted Molding process uses one or two plastic films in the mold. This film is sucked down into the inner surfaces of the mold (culls, runners and cavities) before the lead frames or substrates, i.e. the products to be encapsulated, are loaded into the mold. This is followed by the usual transfer molding process.
Conventional transfer molding.
Encapsulation is a crucial step in the assembly of semiconductors. Basically, there are two major encapsulation techniques: transfer molding and potting or glob topping. Transfer molding is the method of choice for mass production. Aside from that, transfer molding produces higher-quality IC packages. Transfer molding equipment for electronic components consists of a press equipped with platens, one of which contains a chamber known as a pot, in which the molding material is placed and liquified by a combination of heat and pressure. A piston or plunger transfers the melt material into the cavities of the mold via a series of channels known as runners. The typical temperature of the molding process is around 175 °C (347 °F) and the pressure ranges from 3 to 100 bar.