Unistar-Innovate-2-FF-L

The most universal semi-automatic molding system designed for practically any kind of package. Suitable for package technology research, package development, process optimization, qualification runs and small to medium-sized production volumes. This system can handle test molds, 1-strip molds and 2-strip molds. Transfer process technology used in this system is identical to the technology used in automated systems. Works with lead frame, substrate and ceramic carriers as well as individual modules. Comes with Film-Assisted Molding technology as standard. Capacity for carriers of up to 75 x 255 mm.

The most universal semi-automatic molding system.

This system can handle lead frame, substrate, ceramic carriers and single components/modules. It can mold all standard packages. On top of that, this system offers our full range of Film-Assisted Molding technologies. Conversion between packages and/or FAM technologies is highly straightforward and fast.

Package Technology Research, Package Development and Process Optimization.

This system can be equipped with a universal test mold base. Small low-cost mold inserts are available for this mold, making it easy and inexpensive to run process trials, develop new packages and provide first customer samples.

Low to medium-sized volume production.

This system is semi-automatic, meaning that carriers and compound have to be loaded and unloaded manually using easy-to-handle jigs. Mold movements, the transfer process and film handling are fully automated, and 100 % identical to our fully automatic 2-strip systems. User interface and control system are also the same as in our fully automated systems. This system can handle 1-strip production molds and/or 2-strip production molds. These molds can handle low to medium-sized production volumes without having to invest in a fully automatic system. When your volumes grow and you need a fully automated system, you can transfer the 2-strip production mold to the auto system.

Universal test mold design