KnowVation - Introduction of an experienced mold and die producer

<div align="left"> <p><b><font face="Arial, Helvetica, sans-serif" size="1"></font></b> <b>Boschman Technologies is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for all your packaging needs. Boschman Technologies is founded in 1990 and based in Duiven (near Arnhem in The Netherlands) in a modern, well equipped facility on the 'Nieuwgraaf' industry park.<br> <br> The company is a technology leader in the field of manufacturing high-tech auto molding and trim & form systems for the semiconductor industry.</b></p> <p><b>Together with our daughter companies Boschman Technologies Asia in Singapore (BTA), Boschman Technologies Taiwan in Kaohsiung (BTT) and Boschman Technologies Shanghai (BTS) we strive continuously to full fill your needs.</b></p> <p><b>Backend assembly solutions for electronic devices are our core-competence in general. Specifically we concentrate on the following strategic market segments</b></p> <p><b>We concentrate on providing quality solutions for our customers, for every need you have there is a solution. Our commitment to you is that we will always actively work with you side by side to find solutions for your needs.</b></p> <p><b>Our worldwide Sales & Service organization is always standby to provide quality solutions for your needs.</b></p> <p><b>The Flexstar: Super flexible 2-strip automatic molding system capable to mold all new package families without major conversion. Designed to fit in any available Assembly Integration line.</b></p> <p><b>Automatic Molding Systems and Trim&Form systems for Powers and Discrets are strategic market segments for Boschman Technologies. Our Packstar Molding Systems and ATF 6520 Trim & Form Systems are perfectly suited for these applications.</b></p> <p><b>By focussing on reel to reel equipment solutions for molding smartcards. Boschman can offer you state of the art molding systems. Our focus and experience gained over the years enables us to offer you the best price / performance solution</b></p> <p><b>Looking for ways to lower the packaging cost of your MEMS devices? Boschman Technolgies can help you!</b></p> <p><b>CleanStar II: Automatic universal mold cleaning system which offers a green an cost effective mold cleaning solution.</b></p> <p><b>The Flexstar Automatic Molding System: <br> <br> Super flexible 2-strip molding system capable to mold all new package families without major conversion. <br> Designed to fit in any available Assembly Integration line. <br> The Flexstar is standard equipped with a Film Assisted Molding unit enabling you to mold FCIP, BGA, uBGA, Bare die packages and leadless packages.<br> As well as standard packages families like QFP, TQFP, SO, TSOP and TSSOP.</b></p> <p><b>Boschman's Flexstar Molding System is designed to fit in any assembly integration line. It's super flexibility, small footprint and intelligent software ensures trouble free operation and maximum output of your assembly line. The system can be converted easily in the field from stand alone operation to line integration.</b></p> <p><b>Adhesive FilmTechnology is a molding technology invented by Boschman as a better and cheaper solution to mold all leadless devices (QFN, SON). This technology gives the highest quality and process control, absolutely lowest proven C.O.O. by far and limits the number of assembly process steps by intergrating taping and detaping as a standard in the molding system.<br> <br> Adhesive Film Technology enables you to reduce your assembly costs signifivantly. Comared with the pre-tape technology it saves you up to USD 250.000,- per year for one chase system. </b></p> <p><b>Release film Technology enables you to mold advanced packages which need a bare die, bare die-pad or an absolutely clean heatsink. Furthermore it can be applied for very thin BGA packages and sticky compounds. Our release film Technology is astandard technology available on the Flexstar molding system.</b></p> <p><b>Boschman Technologies BV has developed a new concept for molding small packages in a small leadframe very economically. The Packstar 620 is a 6 strips fully automatic multiplunger molding system. We have used as much as much as possible pruduction prooven units from our Packstar 420 molding system.<br> <br> Result is the smallest ever molding system with a 6-strip capacity/shot. Our Packstar 620 is more then 50% smaller then any other automatic multiplunger molding system on the market. On top of that our Packstar 620 is abolutely by far the best price/performance ratio for small packages/small leadframe requirements.</b></p> <p><b>Looking for ways to lower the packaging cost of your MEMS devices? Boschman Technolgies b.v. can help you!<br> <br> The demand for MEMS is continously increasing. Application areas are many, automotive, fiberopticas, security amd bio-industry are just a few examples. <br> <br> The packaging for the MEMS device is custom-made and often manual assembled, which makes it expensive. While packaging costs are already a major part in the production of MEMS devices, packaging costs are becomming even more important with increasing volumes. <br> <br> New technologies are avaible for packaging of MEMS devices by means of transfer molding. Package reliability is ensured by the wide use and fast experience of Boschmans transfer molding technology for semiconductors packages.<br> <br> New technologies are avaible for packaging of MEMS devices by means of transfer molding. Package reliability is ensured by the wide use and fast experience of Boschmans transfer molding technology for semiconductors packages.<br> <br> Transfer molding reduces packages complexity, simplifies assembly and therefore increases reliability and reduces production costs</b>. </p> </div>