Boschman Technologies - Automatic molding solutions and high speed trim & form systems

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	Flexstar Automatic Molding System Designed for stand-alone operation and integration Flexstar System Features Adhesive Film Technology Release Film Technology Seal Film Technology Exposed die Molding BGA Molding


	Flexstar Automatic Molding System
	Super flexible 2-strip molding system capable to mold all new package families without major conversion. Designed to fit in any available Assembly Integration line. The Flexstar is standard equipped with a Film Assisted Molding unit enabling you to mold FCIP, BGA, uBGA, Bare die packages and leadless packages. As well as standard package families like QFP, TQFP, SO, TSOP and TSSOP..
	Flexstar Automatic Molding System 2-strip molding system capable to mold all new package families. Standard equipped with a Film Assisted Molding unit!


	Designed for stand-alone operation
	Boschman's Flexstar Molding System is designed to fit in any assembly integration line. It's super flexibility, small footprint and intelligent software ensures trouble free operation and maximum output of your assembly line. The system can be converted easily in the field from stand alone operation to line integration.


	Flexstar System Features
	Short conversion times for any package type Designed for line integration Standard equipment with FAM unit * Small footprint Unwanted object detection and soft mold close clamp control High precision degate unit Simple and easy to use CE-compatibility Recipe management Process monitoring Lot tracking and individual leadframe tracking Performance monitoring's SECS/GEM Capable of inline and/or offline mold cleaning Molding quality inspection by vision (optional) * Can handle our patented Release- and Adhesive Film Technology

	Adhesive Film Technolog
	Adhesive FilmTechnology is a molding technology invented by Boschman as a better and cheaper solution to mold all leadless devices (QFN, SON). This technology gives the highest quality and process control, absolutely lowest proven C.O.O. by far and limits the number of assembly process steps by integrating taping and de-taping as a standard in the molding system. Adhesive Film Technology enables you to reduce your assembly costs significantly. Compared with the pre-tape technology it saves you up to USD 250.000,- per year for one chase system.


	Release Film Technology
	Release film Technology enables you to mold advanced packages which need a bare die, bare die-pad or an absolutely clean heatsink. Furthermore it can be applied for very thin BGA packages and sticky compounds. Our release film Technology is a standard technology available on the Flexstar molding system. No flash and bleed on die surface No damage on die surface Very clean molding process Possible for substrates or leadframe packages


	Seal Film Technology
	Film Technology allows the package designer to create a bleed and flash free encapsulation process. LLP’s or QFN in matrix lead frames are molded with the film below the lead frame. With Seal Film Technology the film seals the leads and die pads against mold compound bleed and flash. The film functions as a gasket between the chip area and the mold and protects the chip surface from bleed and flash. The encapsulation makes use of a ETFE modified thermoplastic film, which is sucked down in two steps onto the surface of the mold.


	Exposed Die Molding
	Use Flexible, Teflon based film Apply vacuum to hold in cavities For sealing clamp film onto chip by means of spring loaded insert Can use extreme sticky compound due to film release properties


	BGA Molding
	BGA is single cavity or Molded Array Package Extreme sticky compounds to prevent de-lamination problems Bare die used for improved heat condition in flip chip packages Film sealing enables to use Molded Underfill Compounds Use Flexible teflon based film Use vacuum to hold film in cavity before molding No package ejection on extreme sticky compounds due to release properties of film FCIP with bar die application Film keeps the die clean from bleed and flash Overmolded version and bare die versions can be molded in same system ...(only top-mold change)

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