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  We can help you!
 Film Technology
 Expertise, service and equipment
 Examples of transfer molded packages		  
 
 
  Powers & Discretes We can help you!

Looking for ways to lower the packaging cost of your MEMS devices? Boschman Technolgies can help you!

The demand for MEMS is continously increasing. Application areas are many, automotive, fiberoptics, security and bio-industry are just a few examples.

The packaging for the MEMS device is custom-made and often manual assembled, which makes it expensive. While packaging costs are already a major part in the production of MEMS devices, packaging costs are becoming even more important with increasing volumes.

New technologies are available for packaging of MEMS devices by means of transfer molding. Package reliability is ensured by the wide use and longtime experience of Boschmans transfer molding technology for semiconductor packages. Transfer molding reduces packages complexity, simplifies assembly and therefore increases reliability and reduces production costs.
 
  Powers & Discretes Film Technology
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An advanced development in transfer molding is the Film Assisted Molding (FAM) technology where Boschman Technologies is owner of the patent. FAM can be applied in three variations:

Release Film Technology Patented
Ensures easy mold release for thin packages or extreme sticky compounds

Seal Film Technology Patented
Keeps area's free of compound during molding and is used for flash and bleed free molding of sensors, optical devices or bare die applications.

Adhesive Film Technology Patented
For one side molded devices.
 
 
  Powers & Discretes Examples of transfer molded packages
 
Conventional semiconductor devices
Hall-effect sensing in automotive
 
Power and discrete packages
QFN-304 with molded carrier ring
Hall sensor
Wheelspeed sensor
Security devices for automotive
Other packages
Airbag sensor
Coin packages
Advanced packages
BGA packages
 
 
  Powers & Discretes Expertise, service and equipment
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Boschman Technologies offers a wide range of expertise, service and equipment in transfer molding:

Consultancy and support in early package design
Flow simulation
Sample production and pre-production
Production equipment from low to high volume
Customized equipment

Also for trim & form activities we support our customers in product and process development. We deliver production equipment to customers worldwide. The tools we apply in our equipment are designed and manufactured in our in-home toolshop.
 
 
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Boschman Technologies b.v. Nieuwgraaf 336, 6921 RS Duiven, The Netherlands
Phone +31 (0) 26 3194900; info@boschman.nl; http://www.boschman.nl/