Equipment

by Boschman

About Us

Our technology enables revolutionairy solutions 

Boschman specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages.

Our technologies

Ag-Sintering

Silver sintering is a die attach technology offering a void-free and strong bond with high terminal and electrical conductivity. Resulting in high yield and high reliability

Film Assisted Molding (FAM)

Film Assisted Molding is a cluster of unique technologies using double films in the mold before the lead frames to be encapsulated. Resulting in improved package quality.

Reel-to-Reel

Creating the highest productivity by Reel-to-reel molding  which is largely determined by effective mold length and machine time. Resulting in high precision mold tooling.

Our products

Sinterstar Series

For pressurized Ag Sintering,  we have solutions for R&D, Low-Medium  and High volume environment available.

Unistar Series

For Film Assisted transfer Molding,  we have solutions for R&D, Low-Medium  and High volume environment available.

Reelstar Series

Transfer molding solutions for Reel-to-Reel applications.

Download brochures

Our satisfied clients can be found in the following industries:

Automotive

Medical

Military/Avioncis

Mobile

Industrial

Our application areas

Smaller, better and cheaper, we realize the best package for your product!

Get in touch.

Have a quick answer to all your packaging questions.  Request free advice from one of our specialists by filling in the form below.

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247

T     +65 6743 7188

Contact

E      info@boschman.nl
W     www.boschman.nl