Production Equipment

by Boschman

About Us

Our technology enables revolutionary solutions

Boschman specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages.

Our technologies

Ag-Sintering

Silver sintering is a die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. Resulting in high yield and high reliability

Film Assisted Molding (FAM)

Film Assisted Molding is a cluster of unique technologies using double films in the mold before the lead frames to be encapsulated. Resulting in improved package quality.

Reel-to-Reel

Creating the highest productivity by Reel-to-reel molding which is largely determined by effective mold length and machine time. Resulting in high precision mold tooling.

Our products

Sinterstar Series

For pressurized Ag Sintering, we have solutions for R&D, Low-Medium and High volume environment available.

Sinterstar Innovate F-XL

Sinterstar Inline-F-XL-HC

Sinterstar Auto-F-XL-HC

Unistar Series

For Film Assisted transfer Molding, we have solutions for R&D, Low-Medium and High volume environment available.

Unistar Innovate-1-HV-XL

Unistar Innovate-2-NF/FF-L

Unistar Auto-2-FF-L

Unistar Auto-4-FF-XL

Reelstar Series

Transfer molding solutions for Reel-to-Reel applications.

Reelstar Auto-1-NF-S (single reel)

Reelstar Auto-2-NF-S (dual reel)

Download brochures

Get all the information that you need to choose the service or equipment that fits your needs:

Company brochure

Sintertool Solutions

Sinterstar Series - Ag Sintering Technology

Unistar Series - Film Assisted Molding Technology

Reel to Reel Molding Technology

Package Development brochure

Package development and prototyping brochure

Our satisfied clients can be found in the following industries:

Automotive

Medical

Avionics

Mobile

Industrial & Renewables

Our application areas

Smaller, better and cheaper, we realize the best package for your product!

Mems & Sensors

Power Modules & Packages

Optical Packages

2.5D/3D Packages

Smart Cards

Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T +31 26 319 4900

Boschman (SG)

Advanced packaging technology

No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237

T +65 6743 7188

Boschman (CN)

Advanced packaging technology

No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China

中國江苏省苏州市吴中区胥口镇子胥路188号

T +86 188 0918 5028

Contact

E [email protected]
W www.boschman.nl

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