Equipment
by Boschman
Our technology enables revolutionairy solutions
Boschman specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages.
Our technologies
Ag-Sintering
Silver sintering is a die attach technology offering a void-free and strong bond with high terminal and electrical conductivity. Resulting in high yield and high reliability
Film Assisted Molding (FAM)
Film Assisted Molding is a cluster of unique technologies using double films in the mold before the lead frames to be encapsulated. Resulting in improved package quality.
Reel-to-Reel
Creating the highest productivity by Reel-to-reel molding which is largely determined by effective mold length and machine time. Resulting in high precision mold tooling.
Our products
Sinterstar Series
For pressurized Ag Sintering, we have solutions for R&D, Low-Medium and High volume environment available.
Unistar Series
For Film Assisted transfer Molding, we have solutions for R&D, Low-Medium and High volume environment available.
Reelstar Series
Transfer molding solutions for Reel-to-Reel applications.
Download brochures
Our satisfied clients can be found in the following industries:
Our application areas
Get in touch.
Have a quick answer to all your packaging questions. Request free advice from one of our specialists by filling in the form below.
Boschman (NL)
Advanced packaging technology
Stenograaf 3, 6921 EX Duiven
The Netherlands
T +31 26 319 4900
Boschman (SG)
Advanced packaging technology
BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247
T +65 6743 7188
Contact
E info@boschman.nl
W www.boschman.nl
