Optical packages

The optical sensor market contains a broad array of technologies (fiber optics, image sensor, position sensor, spectral imaging etc) and application areas (automotive, medical, consumer, industrial). An interesting new development is the area of Photonics Integrated Circuits (PICs). PICs are devices that integrates multiple (at least two) photonic functions and as such is similar to an electronic integrated circuit, typically also produced in standard semiconductor compliant processes. This means that these devices can increasingly be made at lower cost and in high volumes, and therefore also there is a need for cheaper packaging technology when volumes are growing. The Boschman group focuses on optical devices with exposed windows or over-mold devices in transparent encapsulation (epoxy or silicone), without fibers.

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237

T     +65 6743 7188

   Boschman (CN)

Advanced packaging technology

No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China


T    +86 188 0918 5028


E      info@boschman.nl
W     www.boschman.nl