Unistar Auto-4-FF-XL

Unistar Auto-4-FF-XL

Fully automatic 4-strip Film Assisted Molding system designed for advanced mems, sensors, power, qfn and bga packages. The system can work with lead frames, substrates and ceramic carriers as well as individual modules upto a size of 100×300 mm. Standard equipped with Boschman’s unique and patented double Film Assisted Molding technologies.

 

 

Key specifications and values

The most universal semi-automatic sintering system for all your green, lead free die attach technologies. Silver sintering is a new die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. Resulting in high yield and high reliability.

Z

Precise temperature control up to 320 C

Z

Effective Sintering area 350x270mm

Z

N2 protection integrated during the complete product handling

Z

Guaranteed equal pressure for multi Die applications due to the

Z

Generic tooling possible for prototyping environment

Z

Clip Sintering capable

Z

Fully characterized process and handling parameters

Z

Capable to integrate customer specific processes such as hydrostatic or soft tooling

Z

Closed loop precise pressure control and monitoring

Z

Pressure applied only on areas where required

Z

Enabling highest density tools with interspaces down to 400µm

Z

Development of customer specific system enhancements

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900
F      +31 26 319 4999

   Boschman (Sg)

Advanced packaging technology

BLOCK 161, KALLANG WAY, #01-03/08,
Singapore 349247

T      +65 6743 7188
F      +65 6743 7177

Contact

E      [email protected]
W     www.boschman.nl