Unistar Innovate-2-NF-L

Unistar Innovate-2-NF-L

The most universal semi-automatic molding system designed for conventional packages. Suitable for small to medium sized production volumes. Noted for very short conversion times when moving from one package to another and low cost tooling.

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Key specifications and values

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1 chase for 1 or 2 strips

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Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip

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Maximum Leadframe / panel dimensions 255x75mm

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No, single or double film

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Clamping force up to 100 tons

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Very versatile system for fast and easy conversion between different packages

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Metal surfaces of the mold are kept clear of molding compound

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Integrated de-gate tooling

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Works with lead frame, substrate and ceramic carriers as well as individual modules

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The use of a large variety of molding compounds, including very sticky types and liquid silicone materials

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237

T     +65 6743 7188

Contact

E      [email protected]
W     www.boschman.nl