Unistar Innovate-2-NF/FF-L
Unistar Innovate-2-NF/FF-L
The most universal semi-automatic molding system designed for conventional packages. Suitable for small to medium sized production volumes. Noted for very short conversion times when moving from one package to another and low cost tooling.
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Key specifications and values
1 chase for 1 or 2 strips
Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip
Maximum Leadframe / panel dimensions 255x75mm
No, single or double film
Clamping force up to 100 tons
Very versatile system for fast and easy conversion between different packages
Metal surfaces of the mold are kept clear of molding compound
Integrated de-gate tooling
Works with lead frame, substrate and ceramic carriers as well as individual modules
The use of a large variety of molding compounds, including very sticky types and liquid silicone materials
Boschman (NL)
Advanced packaging technology
Stenograaf 3, 6921 EX Duiven
The Netherlands
T +31 26 319 4900
Boschman (SG)
Advanced packaging technology
No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237
T +65 6743 7188
Boschman (CN)
Advanced packaging technology
No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China
中國江苏省苏州市吴中区胥口镇子胥路188号
T +86 188 0918 5028
Contact
E info@boschman.nl
W www.boschman.nl
