Boschman is proud to announce the completion phase one of our Competence Center in Duiven renovation

Duiven, 6th of March 2020 – Boschman has completed the 1st phase of our Competence Centre renovation

The upgrade project included:

  1.        Expansion our existing micro assembly lab area by nearly 1/3
  2.        Dedicated engineering Office
  3.        New future-proof air treatment system
  4.        New ESD-safe flooring throughout
  5.        New material handling and PPE preparation area
  6.        Doubled our capacity of critical processes: Sintering, Cleaning (Plasma & Wafers) and Die  Bonding.
  7.        New advanced capabilities for Dispensing, Microscopy, Cross sectioning & Polishing.

On top of the new micro assembly area and equipment, our skilled assembly team has been expanded nearly 50% with new motivated colleagues, providing a healthy balance of experienced and new talent.

These investments are part of our overall growth plan and commitment to next generation power packages for EV/HEV & industrial applications, in addition to advanced MEMS & Sensors for biomedical, optical, RF, industrial, military and automotive applications. This strategy is underpinned by our unique capabilities and business proposition to rapidly scale from Idea to Concept to Prototype to High Volume Production: “from Idea to Industrialization”.

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237

T     +65 6743 7188

   Boschman (CN)

Advanced packaging technology

No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China


T    +86 188 0918 5028