Boschman is the one stop shop for highly innovative packaging solutions.

We support you at each and every stage of your package, assembly or Sintering  and Molding equipment needs. From idea to production. Choose the service that fits your needs:

Package development

Research, design and prototyping of advanced packaging concepts is what we do. Develop your tomorrow’s products together, today!                                                               

Assembly services
Small series sampling and low to medium production assembly. From 10 to thousands, from design to advanced packages production. To verify the concept together.
Equipment
Development and supply of advanced packaging equipment (transfer molding & Ag sintering) for efficient and high quality manufacturing.  Our unique technologies will benefit your products.

From idea to industrialization.

Boschman is a high-tech, solution driven Dutch company focusing on advanced packaging solutions. We provide a unique one-stop-shop concept – from idea to industrialization – offering our customers one point of contact for all packaging business. This approach ensures all processes to be carefully monitored and integrated, in order to create the most efficient and effective packaging solution and as short as possible time-to-market.

Our technologies

Ag-Sintering

Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.

Through Polymer Via (TPV)

Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical and/or optical inter-connections through (transfer-molding) package encapsulation.

Film Assisted Molding (FAM)

FAM is a cluster of unique technologies using films in the mold before the products  to be encapsulated by means of transfer molding. This results in  improved package quality.

Dynamic Insert Technology

Dynamic Insert Technology (DIT) is a patented technology that has been developed to further optimize the performance of FAM to automatically and dynamically control pressure.

Our satisfied clients can be found in the following industries:

Automotive

Medical

Military/Avioncis

Mobile

Industrial

Our application areas

Smaller, better and lower cost, we realize the best package for your product!

APEC 2019

Boschman will be hosting a booth at APEC, the most versatile power electronics convention in the USA.

We like to welcome you at our booth #1170 at the Anaheim convention center in California

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Get in touch.

Your questions and comments are important to us. Send us a message by using the contact form  below and our representative will get back to you as soon as possible.

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247

T     +65 6743 7188

Contact

E      info@boschman.nl
W     www.boschman.nl