Film Assisted Molding

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages:

 

  • Precise temperature control up to 320 C
  • Effective Sintering area350x270mm
  • Clip Sintering capable
  • N2 protection integrated during the complete product handling and sinter process
  • Generic tooling possible for prototyping environment
  • Development of customer specific system enhancements
  • Capable to integrate customer specific processes such as hydrostatic or soft tooling
  • Fully characterized process and handling parameters
  • Closed loop precise pressure control and monitoring
  • Pressure applied only on areas where required
  • Guaranteed equal pressure for multi Die applications due to the patented Dynamic Insert Technology (DIT)
  • Enabling highest density tools with interspaces down to 400µm

Our technologie

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

About Boschman Technologies

Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.

We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:

Do you need advice?

Feel free to contact me. You can contact me from Monday to Friday by calling 00-000 000 00 or by mail to [email protected].

I would be happy be of service.

 

Norbert Sormani

Strategic HR advisor

Do you need advice?

Feel free to contact me. You can contact me from Monday to Friday by calling 00-000 000 00 or by mail to [email protected].

I would be happy be of service.

Norbert Sormani

Strategic HR advisor

   Boschman (Nl)

Advanced packaging technology

Stenograaf 3,6921 EX Duiven
The Netherlands

T      +31 26 319 4900
F      +31 26 319 4999

   Boschman (Sg)

Advanced packaging technology

Blk 1026, Tai Seng Ave, #01-3532/3534,Tai Seng Industrial Estate, Singapore 534413

T      +65 6743 7188
F      +65 6743 7177

Contact

E      [email protected]
W     www.boschman.nl