Our technology lets you stand out

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From conceptualization to high yield production.

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Through Polymer Via (TPV)

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Film Assisted Molding (FAM)

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Ag-Sintering Technology

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What we do

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Mems & Sensors

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High Power Modules

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Optical Packages

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Power Packages

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2.5D/3D Packages

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Exposed Packages

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Special Packages

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Smart Cards

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Boschman is the one stop shop for advanced packaging.

 We support you at each and every stage of your package, assembly or equipment needs. From conceptualization to high yield production. Choose the service that fits your needs:

Package development
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Assembly services
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Equipment
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Get in touch.

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   Boschman (Nl)

Advanced packaging technology

Stenograaf 3,6921 EX Duiven
The Netherlands

T      +31 26 319 4900
F      +31 26 319 4999

   Boschman (Sg)

Advanced packaging technology

Blk 1026, Tai Seng Ave, #01-3532/3534,Tai Seng Industrial Estate, Singapore 534413

T      +65 6743 7188
F      +65 6743 7177

Contact

E      sales@boschman.nl
W     www.boschman.nl

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