Duiven, Juy 1^st  2022

Boschman Advanced Packaging Technology is pleased to announce that from 1^st of July 2022 Rydon Technology Ltd is assigned as the Sales Representative partner in the UK and Ireland market. This follows the retirement of John Watkins of Redcroft UK. Boschman would like to thank John Watkins for all his successful work in supporting the market development in the UK and helping in the smooth transfer of existing business to Rydon Technology Ltd.

Rydon Technology bring over 40 years of Advanced Packaging experience being actively involved in many Advanced Molding projects internationally.  Rydon Technology Ltd was founded in 1986 specialising in the supply of equipment and materials for the Semiconductor, Photonics and Electronic Component manufacturing. Rydon Technology are recognised experts in the industry who have a clear passion to ensure success is achieved for its customers in the UK and Ireland.

“Boschman welcomes the opportunity to work closely with Rydon Technology at this exciting time in the development of the Semiconductor Packaging industry in the UK and Ireland. Boschman is a proven expert in Advanced Transfer Molding and Pressure Sintering. This is an exciting time for Power and Automotive Electronics and Wide Gap Semiconductors applications in the UK and Ireland. We believe Boschman and Rydon are the ideal partners to make your designs successful from package development to volume manufacturing”.

We look forward to continuing to develop and support your company and the industry in the UK and Ireland.