Sinterstar Innovate-F-XL-WL

Sinterstar Innovate-F-XL-WL

A universal semi-automatic sintering system for back-side wafer lamination.

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Key specifications and values

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Precise temperature control up to 320 C

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Effective Sintering area 350x270mm

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N2 protection integrated during the complete product handling and sinter process

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Guaranteed equal pressure for multi Die applications due to the patented Dynamic Insert Technology (DIT)

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Generic tooling possible for prototyping environment

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Clip Sintering capable

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Fully characterized process and handling parameters

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Capable to integrate customer specific processes such as hydrostatic or soft tooling

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Closed loop precise pressure control and monitoring

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Pressure applied only on areas where required

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Enabling highest density tools with interspaces down to 400µm

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Development of customer specific system enhancements

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247

T     +65 6743 7188

Contact

E      [email protected]
W     www.boschman.nl