Unistar Auto-4-FF-XL

Unistar Auto-4-FF-XL

Fully automatic 4-strip Film Assisted Molding system designed for advanced mems, sensors, power, qfn and bga packages. The system can work with lead frames, substrates and ceramic carriers as well as individual modules upto a size of 100x300 mm.

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Key specifications and values

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1 or 2 chases / 2 or 4 strips

 

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Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip

 

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Maximum Leadframe / panel dimensions 255x75mm

 

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No, single or double film

 

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Class 100 cleanroom option for optical devices

 

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Secs-Gem communication package for interfacing with a customer’s MES system, production traceability and recipe management

 

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Clamping force up to 200 tons

 

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Very versatile system for fast and easy conversion between different packages

 

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Metal surfaces of the mold are kept clear of molding compound

 

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Maximum Leadframe / panel dimensions 300x100mm

 

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Extremely long life-time of tooling resulting in very low running costs

 

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Many options standard available for enabling fast change-overs, productivity improvements and quality assurance

 

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Integrated de-gate tooling

 

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Works with lead frame, substrate and ceramic carriers as well as individual modules

 

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The use of a large variety of molding compounds, including very sticky types and liquid silicone materials

 

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Integrated cassette handlers

 

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Large list of system options for increasing production efficiency, process control and guaranteeing the best quality

 

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247

T     +65 6743 7188

Contact

E      info@boschman.nl
W     www.boschman.nl