Find out more about Boschman advanced packaging technology in our videos below:

Ag Sintering Technology by Boschman

Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.

Film Assisted Molding Technology by Boschman

Learn more about our Film Assisted transfer Molding equipment

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247

T     +65 6743 7188