2.5/3D packages

(Quasi) monolithic integration (System in Package or SIP) is an ongoing trend to increase functionality and reduce cost. This includes technologies such as the integration of multiple active and passive (pre-packaged) components into one over-mold package, die-stacking and package stacking. A high level of customization is necessary when developing these kind of packages. Boschman is currently also developing a new technology (through polymer vias) that holds great promise for stacking and multi-functional integration.

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237

T     +65 6743 7188


E      [email protected]
W     www.boschman.nl