Unistar Innovate-2-FF-L

Unistar Innovate-2-FF-L

The most universal semi-automatic molding system designed for practically any kind of package. Works with lead frames, substrates, ceramic carriers and individual modules. Can handle standard mini-pellets, powder and liquid encapsulation materials.

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Key specifications and values

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1 chase for 1 or 2 strips

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Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip

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Maximum Leadframe / panel dimensions 255x75mm

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No, single or double film

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Clamping force up to 100 tons

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Very versatile system for fast and easy conversion between different packages

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Metal surfaces of the mold are kept clear of molding compound

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Integrated de-gate tooling

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Works with lead frame, substrate and ceramic carriers as well as individual modules

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The use of a large variety of molding compounds, including very sticky types and liquid silicone materials

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237

T     +65 6743 7188

Contact

E      [email protected]
W     www.boschman.nl